With versions A and B of the alcohol-based fluxes EO-B-008 and EO-B-013, the Hessian flux specialist enables even better harmonisation with the soldering process in electronics production. Emil Otto is continuing to consequently pursue the path of different solid content levels in the fluxes in order to be able to offer its customers an extended standard product for the corresponding soldering process.
Credit: EMIL OTTO Flux- und Oberflächentechnik GmbH
EO-B-008 has a high solids content of 4 wt.-% and was specially developed for short cycle wave soldering systems. It is ideal for applications in which the PCB remains in the preheating phase for an extended period of time before the soldering process takes place in a particularly active solder wave. ‘By using the EO-B-008, excellent solder joints are achieved, while the PCB has an extremely clean, residue-free surface after the soldering process. This contributes significantly to the high quality and reliability of the end product. To optimize this quality even more, we have decided to develop further variants of the EO-B-008,’ explains Markus Geßner, Head of Marketing and Sales at Emil Otto GmbH.
EO-B-008A, for example, has a solids content of 2%. It is a high-performance No Clean-Flux based on alcohol with dicarboxylic acids and synthetic resin. This flux was developed for wave soldering processes as well as for dip soldering processes and cable assembly. The same applies to the EO-B-008B version, which has a solids content of 3%. This flux is also versatile and can be used for wave soldering as well as for special applications with good results. The EO-B008A variant has also been developed specifically for full tunnel nitrogen applications and guarantees significantly better soldering results than conventional adipic acid solutions under full nitrogen due to a wide process window and high temperature stability.
The EO-B-013 is a multiflux focussing on wave and selective soldering. The flux is also based on alcohol with dicarboxylic acids and a synthetic resin complex. The flux can also be used in the dip soldering process in cable assembly. The flux is applied using the spray flux method. ‘EO-B-013 is also a No Clean-Flux with exceptional properties and excellent residue behaviour. We are now offering versions A and B of these products as well,’ continues Geßner. The EO-B-013A has a solids content of 2% and, like the A version of the EO-B-008, it was developed specifically for full-tunnel nitrogen applications; the B version has a solids content of 3%.
All A and B variants of fluxes EO-B-008 and EO-B-013 are available in canisters of 5 and 20 litres. Other containers are available on request.