- Electrical connectivity specialist Weidmüller uses BASF polyphthalamide (PPA) in its OMNIMATE® 4.0 product family
- Ultramid® Advanced N3U41 G6 can be flexibly colored in many RAL colors
- The high temperature resistance of BASF’s PPA enables reflow soldering of E&E components
Credit: BASF
Due to its flexible colorability, the BASF PPA Ultramid® Advanced N3U41 G6 is now being used by Weidmüller in its PCB connectors and terminals.
The electrical engineering company Weidmüller, Germany, uses Ultramid® Advanced N3U41 G6 for the PCB connectors and terminals of its new OMNIMATE® 4.0 product family. The BASF polyphthalamide (PPA) is characterized by its flexible colorability in RAL colors such as color-stable orange, blue, and green, thus contributing to the safe assembly and maintenance of E&E components. Thanks to its outstanding chemical resistance, dimensional stability, and very good processability, Ultramid® Advanced N improves the robustness and durability of OMNIMATE® 4.0 components. Due to its high temperature resistance, the BASF PPA is suitable for reflow soldering, a process used to fasten E&E components to printed circuit boards. In this way, it supports the growing demands for automation and cost efficiency in the manufacturing of high-performance electronics for drive technology, power supply, and energy distribution.
Ultramid® Advanced N3U41 G6 enables the production of connectors and PCB terminals in customized colors; the relevant UL Yellow Cards apply to all colors (all color listing). This allows customers to respond flexibly to the respective color coding required in the E&E industry for the assembly and maintenance of electronic components. “We are delighted that we were able to convince Weidmüller both with our high-performance material and with the wide range of colors available,” says Andreas Stockheim from business management for PPAs at BASF. “BASF is the leading company on the market offering customers a broad selection of pre-colored granules for this PA9T and other PPAs. It is also possible to use UL-certified masterbatches for self-coloring.”
Weidmüller’s PCB components transmit power in a compact design and meet high voltage requirements. Thanks to the snap-in connection technology, they enable fast, tool-free wiring, accelerating assembly. “Our OMNIMATE® 4.0 product family is ideally suited for fully automated wiring processes,” says Johann Klippenstein, Head of Device Connectors at Weidmüller. “The BASF PPA fits perfectly into this concept, as its mechanical and electrical properties remain at a high level even in small connectors. Combined with the exceptionally wide color palette, we offer our customers a safe solution that complies with DIN standard VDE 60335-1 and can be flexibly adapted to new requirements in high performance electronics.” Ultramid® Advanced N3U41 G6 is very easy to process: It offers flowability comparable to liquid crystal polymer (LCP) and is supplied in a small granule size, which facilitates processing on smaller injection molding machines.
The BASF PPA meets the steadily increasing requirements for PCB components needed for power electronics in a growing number of industries. Materials must withstand higher temperatures, provide long-lasting electrical insulation, and maintain dimensional stability even under challenging environmental conditions like moisture, dust, and dirt. The laser-sensitive Ultramid® Advanced N3U41 G6 LS with non-halogenated flame retardant combines high heat resistance with low water absorption and outstanding electrical properties. It shows a high comparative tracking index (CTI) of 600 (according to IEC 60112). Thanks to the reduced creepage distance, it is well suited for the miniaturization of electrical components. The UL-certified PPA features a high relative thermal index (RTI) of 150 °C.
About Ultramid® Advanced
BASF’s polyphthalamide portfolio is based on the six polymers Ultramid® Advanced N (PA9T), Ultramid® Advanced T1000 (PA6T/6I), Ultramid® Advanced T2000 (PA6T/66), Ultramid® T KR (PA6T/6), Ultramid® T6000 (PA66/6T) and Ultramid® T7000 (PA/PPA). They open the door to the next generation of lightweight, high-performance plastic components in many different sectors including the automotive industry, electronics and electric devices, mechanical engineering and consumer goods. The PPA portfolio is available globally and complemented by BASF’s Ultrasim® simulation tool and extensive experience in application development. It includes more than 50 compounded grades for injection molding and extrusion, products with or without flame retardants. The compounds are available in different colors, from colorless to laser-markable black, with short-glass or mineral fiber reinforcement, and with various heat stabilizers.